Critical Technology

Semiconductor Equipment & Materials

The capacity to build the machines and supply the materials that make chipmaking possible: lithography, deposition, etch and metrology equipment, photoresists, wafers and speciality chemicals and gases. One of the capabilities of Semiconductors & Advanced Computing.

International families: 97k2015 to 2024
Leading country: Japan2.4× the next
All families: 227khome filings included
Over five years: Rising2020 to 2024 against the five before

Year by year

Patent families by country of origin and the year of the earliest filing, 2000 to 2025; 2025 is a part year, still filling in. International families are those for which protection was sought beyond one country.

Volume

International patent families in the capability, by the year of the earliest filing.

Source: Global Institute for National Capability (GINC), 2026. Underlying patents from 107 patent offices, IFI CLAIMS and Google

Share by country

Each country's share of the year's international families, in per cent: the capability's five largest countries of origin, 2015 to 2024, and the rest of the world.

Source: Global Institute for National Capability (GINC), 2026. Underlying patents from 107 patent offices, IFI CLAIMS and Google

Country leaderboard

International patent families, 2015 to 2024, by country of origin. Growth compares the latest five full years with the five before.

Ten largest

Japan

United States

South Korea

China

Taiwan

Netherlands

Germany

France

United Kingdom

Switzerland

37,853

15,529

13,584

8,665

6,232

4,507

4,429

1,170

663

536


1	Japan	37,853	39.2%	1.0×	54,368
2	United States	15,529	16.1%	1.0×	20,089
3	South Korea	13,584	14.1%	1.6×	37,116
4	China	8,665	9.0%	1.6×	87,535
5	Taiwan	6,232	6.5%	1.1×	9,540
6	Netherlands	4,507	4.7%	1.4×	4,816
7	Germany	4,429	4.6%	1.1×	6,198
8	France	1,170	1.2%	0.8×	1,332
9	United Kingdom	663	0.7%	0.8×	747
10	Switzerland	536	0.6%	1.0×	607
11	Singapore	495	0.5%	1.5×	595
12	Israel	411	0.4%	1.8×	510
13	Austria	392	0.4%	1.1×	427
14	Belgium	279	0.3%	0.8×	294
15	Canada	251	0.3%	1.0×	298
16	Finland	221	0.2%	1.1×	245
17	Italy	188	0.2%	1.0×	227
18	Sweden	180	0.2%	1.0×	187
19	Australia	80	0.1%	1.0×	90
20	Luxembourg	80	0.1%	0.1×	82
21	Poland	70	0.1%	1.5×	162
22	Spain	64	0.1%	0.7×	80
23	India	52	0.1%	1.7×	60
24	Denmark	50	0.1%	0.9×	52
25	Malaysia	50	0.1%	1.1×	84
26	Ireland	46	0.0%	1.7×	96
27	Russia	41	0.0%	0.5×	511
28	Czechia	41	0.0%	1.2×	54
29	Saudi Arabia	40	0.0%	0.4×	76
30	Hong Kong	39	0.0%	0.9×	68
31	Cayman Islands	39	0.0%	0.1×	151
32	Türkiye	36	0.0%	3.0×	70
33	Norway	35	0.0%	0.8×	35
34	Liechtenstein	16	0.0%	3.0×	22
35	Brazil	15	0.0%	0.9×	54
36	Portugal	15	0.0%	2.0×	21
37	New Zealand	11	0.0%	1.2×	12
38	Mexico	9	0.0%	0.5×	44
39	Hungary	8	0.0%	1.7×	14
40	South Africa	4	0.0%	3.0×	5

Applicants

The largest applicants by international patent families, 2015 to 2024: across the world, then within each of the five countries with the most families in Semiconductor Equipment & Materials. Names are as held in the source and are not consolidated across subsidiaries.

Global

96,569 international families

TOKYO ELECTRON LTD · Japan

APPLIED MATERIALS INC · United States

SAMSUNG ELECTRONICS CO LTD · South Korea

TAIWAN SEMICONDUCTOR MFG CO LTD · Taiwan

ASML NETHERLANDS BV · Netherlands

FUJIFILM CORP · Japan

6,196

4,982

3,468

3,077

2,828

1,977

Japan

37,853 international families

TOKYO ELECTRON LTD

FUJIFILM CORP

DISCO CORP

DISCO ABRASIVE SYSTEMS LTD

SCREEN HOLDINGS CO LTD

CANON KK

6,175

1,977

1,787

1,762

1,676

1,523

United States

15,529 international families

APPLIED MATERIALS INC

LAM RES CORP

KLA CORP

KLA TENCOR CORP

ENTEGRIS INC

INTEL CORP

4,837

1,856

753

663

383

263

South Korea

13,584 international families

SAMSUNG ELECTRONICS CO LTD

SEMES CO LTD

SAMSUNG DISPLAY CO LTD

DONGWOO FINE CHEM CO LTD

SAMSUNG SDI CO LTD

LG CHEMICAL LTD

3,458

1,668

1,231

508

478

295

China

8,665 international families

BOE TECHNOLOGY GROUP CO LTD

BEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD

ADVANCED MICRO FAB EQUIP INC

ADVANCED MICRO FABRICATION EQUIPMENT INC CHINA

CHANGXIN MEMORY TECH INC

XIAN ESWIN MATERIAL TECHNOLOGY CO LTD

694

516

481

361

225

Taiwan

6,232 international families

TAIWAN SEMICONDUCTOR MFG CO LTD

TAIWAN SEMICONDUCTOR MFG

GLOBALWAFERS CO LTD

1.9% shared · 3,265 families in both

United States

Japan

China

Germany

South Korea

16,120

13,036

11,408

6,357

5,716

Crosswalk

How Semiconductor Equipment & Materials is matched to the patent classifications. The entries below were chosen for it; each stands for itself and everything beneath it in the scheme, 1,133 Cooperative entries in all. A patent family counts when any of its codes, in either scheme and at any office, falls under one of them. Codes since retired are placed under the entries that replaced them.

Entry	Title in the scheme	Why it is chosen	CPC codes	IPC codes	Documents
G03F	Photomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices; materials therefor; originals therefor; apparatus specially adapted therefor	Photolithography: exposure tools, photoresists, masks	452	127	2,042,367
H10P72/00	Handling or holding of wafers, substrates or devices during manufacture or treatment thereof	Wafer handling, holding and processing apparatus	300	14	2,119,679
H01J37/32	Gas-filled discharge tubes	Plasma processing chambers for etch and deposition	144	3	629,441
H01J37/30	Electron-beam or ion-beam tubes for localised treatment of objects	Electron-beam and ion-beam tools, including ion implanters	22	8	90,395
C23C16/00	Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes	Chemical vapour deposition and atomic layer deposition	176	45	1,007,868
C30B	Single-crystal growth; unidirectional solidification of eutectic material or unidirectional demixing of eutectoid material; refining by zone-melting of material; production of a homogeneous polycrystalline material with defined structure; single crystals or homogeneous polycrystalline material with defined structure; after-treatment of single crystals or a homogeneous polycrystalline material with defined structure; apparatus therefor	Single-crystal growth and epitaxy for wafers	220	166	490,327
C09G1/02	Polishing compositions containing abrasives or grinding agents	Polishing slurries for wafer planarisation	1	1	33,308
C09K13/00	Etching, surface-brightening or pickling compositions	Etching compositions	7	7	25,213
G01N21/9501	Semiconductor wafers	Optical inspection of semiconductor wafers	3	none	33,155
C30B29/30	Niobates; Vanadates; Tantalates	Left out
C30B29/36	Carbides	Left out
C30B29/38	Nitrides	Left out
C30B29/40	AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi	Left out

CPC and IPC codes are the codes in use on patent documents, at any office, that fall under the entry. Documents is the larger of the two schemes' counts of documents carrying one of them. An entry with no IPC codes can be told apart only in the Cooperative scheme.

The Cooperative codes in use that count towards Semiconductor Equipment & Materials: 1,325 codes on 6,462,863 documents. The 150 most used are listed; the full list is in the cpc-to-capability.csv download.

Code	Title	Under entry	How placed	Documents
H10P72/74	Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support	H10P72/00	In the scheme	67,920
H10P72/0402	Apparatus for fluid treatment	H10P72/00	In the scheme	65,119
G03F7/004	Photosensitive materials	G03F	In the scheme	63,847
G03F7/20	Exposure; Apparatus therefor	G03F	In the scheme	57,258
G03F7/0045	Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors	G03F	In the scheme	54,363
H10P72/0604	Process monitoring, e.g. flow or thickness monitoring	H10P72/00	In the scheme	45,456
G03F7/027	Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds	G03F	In the scheme	45,188
H10P72/0434	Apparatus for thermal treatment mainly by convection	H10P72/00	In the scheme	43,013
H10P72/0428	Apparatus for mechanical treatment or grinding or cutting	H10P72/00	In the scheme	42,694
H10P72/0421	Apparatus for fluid treatment for etching for drying etching	H10P72/00	In the scheme	41,818
H10P72/7402	Wafer tapes, e.g. grinding or dicing support tapes	H10P72/00	In the scheme	41,121
C23C16/52	Controlling or regulating the coating process	C23C16/00	In the scheme	40,916
C30B29/06	Silicon	C30B	In the scheme	40,474
H10P72/0414	Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles	H10P72/00	In the scheme	39,555
G03F7/0002	Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping	G03F	In the scheme	38,302
H10P72/50	Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment	H10P72/00	In the scheme	37,358
H01J37/3244	Gas supply means	H01J37/32	In the scheme	37,308
H10P72/0602	Temperature monitoring	H10P72/00	In the scheme	37,083
H10P72/7416	Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding	H10P72/00	In the scheme	36,408
H10P72/78	Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks	H10P72/00	In the scheme	36,135
G03F7/038	Macromolecular compounds which are rendered insoluble or differentially wettable	G03F	In the scheme	35,936
H10P72/3302	Mechanical parts of transfer devices	H10P72/00	In the scheme	34,648
H10P72/0606	Position monitoring, e.g. misposition detection or presence detection	H10P72/00	In the scheme	33,618
C09G1/02	Polishing compositions containing abrasives or grinding agents	C09G1/02	In the scheme	33,308
H10P72/0432	Apparatus for thermal treatment mainly by conduction	H10P72/00	In the scheme	33,294
H10P72/0448	Apparatus for applying a liquid, a resin, an ink or the like	H10P72/00	In the scheme	32,631
H10P72/0436	Apparatus for thermal treatment mainly by radiation	H10P72/00	In the scheme	29,600
G03F7/039	Macromolecular compounds which are photodegradable, e.g. positive electron resists	G03F	In the scheme	29,492
H10P72/0431	Apparatus for thermal treatment	H10P72/00	In the scheme	29,155
G03F7/0397	Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain	G03F	In the scheme	29,060
H10P72/7624	Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support	H10P72/00	In the scheme	28,866
G03F7/40	Treatment after imagewise removal, e.g. baking	G03F	In the scheme	28,719
G03F7/11	Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers	G03F	In the scheme	28,475
G01N21/9501	Semiconductor wafers	G01N21/9501	In the scheme	27,800
C23C16/56	After-treatment	C23C16/00	In the scheme	27,640
G03F7/0392	Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition	G03F	In the scheme	27,508
H10P72/72	Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks	H10P72/00	In the scheme	26,875
H10P72/7612	Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins	H10P72/00	In the scheme	26,211
H10P72/722	Details of electrostatic chucks	H10P72/00	In the scheme	26,198
G03F7/0007	Filters, e.g. additive colour filters; Components for display devices	G03F	In the scheme	25,991
H01J37/32449	Gas control, e.g. control of the gas flow	H01J37/32	In the scheme	25,260
H01J37/32715	Workpiece holder	H01J37/32	In the scheme	25,220
H10P72/70	Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping	H10P72/00	In the scheme	24,214
H10P72/7602	Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance	H10P72/00	In the scheme	24,130
C23C16/50	Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges	C23C16/00	In the scheme	23,187
H10P72/0406	Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like	H10P72/00	In the scheme	22,410
H10P72/7618	Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel	H10P72/00	In the scheme	22,234
G03F7/0046	Photosensitive materials with perfluoro compounds, e.g. for dry lithography	G03F	In the scheme	21,562
C23C16/4412	Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps	C23C16/00	In the scheme	21,549
H10P72/0462	Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers	H10P72/00	In the scheme	21,427
G03F7/033	Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers	G03F	In the scheme	21,083
H10P72/0442	Apparatus for placing on an insulating substrate, e.g. tape	H10P72/00	In the scheme	21,043
H01J37/32082	Radio frequency generated discharge	H01J37/32	In the scheme	20,967
C23C16/455	Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber	C23C16/00	In the scheme	20,727
C23C16/46	Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate	C23C16/00	In the scheme	20,691
C23C16/26	Deposition of carbon only	C23C16/00	In the scheme	20,602
C23C16/45565	Shower nozzles	C23C16/00	In the scheme	20,148
H01J37/321	Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma	H01J37/32	In the scheme	19,959
G03F7/031	Organic compounds not covered by group G03F7/029	G03F	In the scheme	19,937
H10P72/0441	Apparatus for sealing, encapsulating, glassing, decapsulating or the like	H10P72/00	In the scheme	19,715
G03F7/70633	Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching	G03F	In the scheme	19,666
G03F7/16	Coating processes; Apparatus therefor	G03F	In the scheme	19,422
H10P72/53	Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means	H10P72/00	In the scheme	19,360
C23C16/045	Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates	C23C16/00	In the scheme	19,293
H10P72/3202	Mechanical details, e.g. rollers or belts	H10P72/00	In the scheme	19,135
C23C16/45553	Atomic layer deposition [ALD] characterized by the use of precursors specially adapted for ALD	C23C16/00	In the scheme	19,017
H10P72/7424	Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used as a support during the manufacture of self-supporting substrates	H10P72/00	In the scheme	18,952
H01J37/32174	Circuits specially adapted for controlling the RF discharge	H01J37/32	In the scheme	18,892
H01J37/32091	Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma	H01J37/32	In the scheme	18,654
G03F7/168	Finishing the coated layer, e.g. drying, baking, soaking	G03F	In the scheme	18,559
C23C16/45525	Atomic layer deposition [ALD]	C23C16/00	In the scheme	18,472
H10P72/744	Details of chemical or physical process used for separating the auxiliary support from a device or a wafer	H10P72/00	In the scheme	18,461
C30B25/02	Epitaxial-layer growth	C30B	In the scheme	18,419
H10P72/0612	Production flow monitoring, e.g. for increasing throughput	H10P72/00	In the scheme	18,345
G03F7/2041	Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means	G03F	In the scheme	18,225
G03F7/2004	Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light	G03F	In the scheme	17,942
C23C16/45544	Atomic layer deposition [ALD] characterized by the apparatus	C23C16/00	In the scheme	17,817
C23C16/401	Oxides containing silicon	C23C16/00	In the scheme	17,769
H10P72/3402	Mechanical parts of transfer devices	H10P72/00	In the scheme	17,538
H10P72/0446	Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates	H10P72/00	In the scheme	17,537
H10P72/0616	Monitoring of warpages, curvatures, damages, defects or the like	H10P72/00	In the scheme	17,328
C23C16/34	Nitrides	C23C16/00	In the scheme	17,264
G03F7/091	Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement	G03F	In the scheme	17,113
G03F7/70341	Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply	G03F	In the scheme	17,020
H01J37/3171	Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation	H01J37/30	In the scheme	16,936
G03F7/0382	Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition	G03F	In the scheme	16,861
C23C16/44	Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating	C23C16/00	In the scheme	16,715
H10P72/0408	Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying	H10P72/00	In the scheme	16,505
G03F7/26	Processing photosensitive materials; Apparatus therefor	G03F	In the scheme	16,422
H01J37/32935	Monitoring and controlling tubes by information coming from the object and/or discharge	H01J37/32	In the scheme	16,282
H01J37/32724	Temperature	H01J37/32	In the scheme	16,214
G03F7/7085	Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load	G03F	In the scheme	15,995
C23C16/345	Silicon nitride	C23C16/00	In the scheme	15,932
C23C16/40	Oxides	C23C16/00	In the scheme	15,859
H10P72/00	Handling or holding of wafers, substrates or devices during manufacture or treatment thereof	H10P72/00	In the scheme	15,697
H10P72/0424	Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles	H10P72/00	In the scheme	15,595
H10P72/7611	Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile	H10P72/00	In the scheme	15,498
G03F7/70716	Stages	G03F	In the scheme	15,492
G03F1/36	Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes	G03F	In the scheme	15,490
G03F7/162	Coating on a rotating support, e.g. using a whirler or a spinner	G03F	In the scheme	15,333
G03F7/105	Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images	G03F	In the scheme	15,186
C23C16/54	Apparatus specially adapted for continuous coating	C23C16/00	In the scheme	15,083
G03F7/38	Treatment before imagewise removal, e.g. prebaking	G03F	In the scheme	15,048
H10P72/7422	Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer	H10P72/00	In the scheme	14,932
H10P72/7616	Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material	H10P72/00	In the scheme	14,759
G03F7/70033	Production of exposure light, i.e. light sources by plasma extreme ultraviolet [EUV] sources	G03F	In the scheme	14,691
C23C16/505	Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges	C23C16/00	In the scheme	14,625
H10P72/06	Apparatus for monitoring, sorting, marking, testing or measuring	H10P72/00	In the scheme	14,577
H10P72/0468	Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process	H10P72/00	In the scheme	14,527
G03F7/028	Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators	G03F	In the scheme	14,265
G03F7/70775	Position control, e.g. interferometers or encoders for determining the stage position	G03F	In the scheme	14,254
C23C16/24	Deposition of silicon only	C23C16/00	In the scheme	14,131
H10P72/743	Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers	H10P72/00	In the scheme	13,967
H10P72/3218	Conveying cassettes, containers or carriers	H10P72/00	In the scheme	13,963
C23C16/30	Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides	C23C16/00	In the scheme	13,919
G03F7/00	Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor	G03F	In the scheme	13,748
H10P72/30	Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations	H10P72/00	In the scheme	13,723
H01J37/32357	Generation remote from the workpiece, e.g. down-stream	H01J37/32	In the scheme	13,448
G03F7/70625	Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness	G03F	In the scheme	13,392
G03F7/32	Liquid compositions therefor, e.g. developers	G03F	In the scheme	13,337
H01J37/32183	Matching circuits	H01J37/32	In the scheme	13,035
C23C16/4586	Elements in the interior of the support, e.g. electrodes, heating or cooling devices	C23C16/00	In the scheme	12,970
G03F7/705	Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions	G03F	In the scheme	12,882
G03F7/322	Aqueous alkaline compositions	G03F	In the scheme	12,773
C23C16/403	Oxides of aluminium, magnesium or beryllium	C23C16/00	In the scheme	12,652
H01J37/32568	Relative arrangement or disposition of electrodes; moving means	H01J37/32	In the scheme	12,625
C23C16/45561	Gas plumbing upstream of the reaction chamber	C23C16/00	In the scheme	12,549
G03F7/0388	Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer	G03F	In the scheme	12,491
C23C16/18	Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds	C23C16/00	In the scheme	12,382
G03F7/0757	Macromolecular compounds containing Si-O, Si-C or Si-N bonds	G03F	In the scheme	12,230
C23C16/0272	Deposition of sub-layers, e.g. to promote the adhesion of the main coating	C23C16/00	In the scheme	12,205
C23C16/402	Silicon dioxide	C23C16/00	In the scheme	12,134
H01L21/67017	Retired code	H10P72/00	Retired, by concordance	12,088
C23C16/45536	Use of plasma, radiation or electromagnetic fields	C23C16/00	In the scheme	11,988
C23C16/4405	Cleaning of reactor or parts inside the reactor by using reactive gases	C23C16/00	In the scheme	11,976
C30B15/00	Single-crystal growth by pulling from a melt, e.g. Czochralski method	C30B	In the scheme	11,954
H10P72/04	Apparatus for manufacture or treatment	H10P72/00	In the scheme	11,906
H10P72/7614	Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions	H10P72/00	In the scheme	11,882
G03F7/094	Multilayer resist systems, e.g. planarising layers	G03F	In the scheme	11,872
C23C16/405	Oxides of refractory metals or yttrium	C23C16/00	In the scheme	11,840
C30B33/00	After-treatment of single crystals or homogeneous polycrystalline material with defined structure	C30B	In the scheme	11,808
H01J37/3174	Particle-beam lithography, e.g. electron beam lithography	H01J37/30	In the scheme	11,790
C23C16/4584	Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally the substrate being rotated	C23C16/00	In the scheme	11,734
G03F7/30	Imagewise removal using liquid means	G03F	In the scheme	11,727
H10P72/7626	Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft	H10P72/00	In the scheme	11,727
H01J37/32192	Microwave generated discharge	H01J37/32	In the scheme	11,700
H10P72/0464	Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber	H10P72/00	In the scheme	11,591
H10P72/3306	Horizontal transfer of a single workpiece	H10P72/00	In the scheme	11,458
H10P72/3404	Storage means	H10P72/00	In the scheme	11,240
H10P72/0416	Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels	H10P72/00	In the scheme	11,239

Match: Direct

The capability is itself a technology or a kind of physical system, and the classification names it. Chemical vapour deposition and crystal growth also serve non-semiconductor uses; wafer inspection is CPC only. The crosswalk is a first pass that nobody has reviewed.

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